Agrawal / Mummaneni / Sathyakam

Interconnect Technologies for Integrated Circuits and Flexible Electronics

Springer

ISBN 9789819944750

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Bibliografische Daten

Fachbuch

Buch. Hardcover

2023

30 s/w-Abbildungen, 121 Farbabbildungen, Bibliographien.

In englischer Sprache

Umfang: x, 280 S.

Format (B x L): 15,5 x 23,5 cm

Gewicht: 659

Verlag: Springer

ISBN: 9789819944750

Produktbeschreibung

This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.

Autorinnen und Autoren

Kundeninformationen

Focuses on the investigation of advanced on-chip interconnects to match the current and future technology requirements Enriches understanding by including contributions from leading experts across the globe Broadens understanding of interconnect technologies for flexible electronic system

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