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Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications
Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3
Springer
ISBN 978-3-032-20317-5
Standardpreis
Bibliografische Daten
Fachbuch
Buch. Hardcover
2026
27 s/w-Abbildungen, 54 Farbabbildungen.
In englischer Sprache
Umfang: v, 306 S.
Format (B x L): 15,5 x 23,5 cm
Verlag: Springer
ISBN: 978-3-032-20317-5
Weiterführende bibliografische Daten
Das Werk ist Teil der Reihe: Lecture Notes in Electrical Engineering
Produktbeschreibung
This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025. The book is divided into four volumes, and it covers papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world and shares the latest breakthroughs in and promising solutions to the most important issues facing today’s society.
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